Laser glass cutting with ultra-short IR pulses is lately growing to become a key technique for the high throughput glass processing.
Cutting thick glasses (>500um) using this technique possess unique challenges, as the laser energy needs to be both focused to a tight spot, and spread evenly in the glass depth. Holo/Or offers several solutions to help our customers with their glass cutting needs.
For customers interested in a full solution and optimal performance, we have recently launched the DeepCleave™ Module, with a spot of <2um diameter, having uniform intensity over a range of >1mm in air and >90% efficiency. This is a stand-alone solution, requiring no external focus optics, and is designed to work with single mode lasers and a specific beam diameter input.
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